Faci na SMT yana nufin taƙaita jerin hanyoyin aiwatarwa bisa PCB. PCB (Printed Circuit Board) allo ne da aka buga.
SMT shine takaitaccen fasahar Surface Mounted Technology, wanda shine mafi shaharar fasaha da tsari a masana'antar hada-hadar lantarki. Fasahar haɗar da'ira ta lantarki (Surface Mount Technology, SMT) ita ake kira daɗaɗɗen dutse ko fasahar hawan ƙasa. Hanya ce ta shigar da abubuwan da aka ɗora maras gubar ko gajeriyar gubar (wanda ake kira SMC/SMD, da ake kira guntu abubuwan da ke cikin Sinanci) a saman allon da'ira da aka buga (PCB) ko wani abu. Fasahar haɗuwa da da'ira wacce aka haɗa ta hanyar siyarwa ta amfani da hanyoyi kamar siyarwar sake kwarara ko siyarwar tsomawa.
A cikin tsarin waldawar SMT, nitrogen ya dace sosai azaman iskar gas mai karewa. Babban dalili shi ne, ƙarfin haɗin gwiwarsa yana da yawa, kuma halayen sinadaran zasu faru ne kawai a cikin matsanancin zafi da matsa lamba (> 500C,> 100bar) ko kuma tare da ƙarin makamashi.
Nitrogen janareta a halin yanzu shine mafi dacewa kayan samar da nitrogen da ake amfani da su a cikin masana'antar SMT. A matsayin kayan aikin samar da nitrogen a kan shafin, mai samar da nitrogen yana da cikakken atomatik kuma ba a kula da shi ba, yana da tsawon rayuwa, kuma yana da ƙarancin gazawa. Yana da matukar dacewa don samun nitrogen, kuma farashi kuma shine mafi ƙasƙanci a cikin hanyoyin da ake amfani da ita a halin yanzu na amfani da nitrogen!
An yi amfani da Nitrogen wajen sake dawo da siyar da iskar gas kafin a yi amfani da iskar iskar gas wajen sarrafa igiyar ruwa. Wani ɓangare na dalilin shi ne cewa masana'antar IC matasan sun daɗe suna amfani da nitrogen a cikin reflow soldering na saman-Dutsen yumbu matasan da'irori. Lokacin da wasu kamfanoni suka ga amfanin matasan IC masana'antu, sun yi amfani da wannan ka'ida zuwa PCB soldering. A cikin irin wannan nau'in walda, nitrogen kuma yana maye gurbin iskar oxygen a cikin tsarin. Ana iya shigar da Nitrogen a kowane yanki, ba kawai a yankin da ake sake kwarara ba, har ma don sanyaya tsarin. Yawancin tsarin sake kwarara yanzu suna shirye-shiryen nitrogen; Ana iya haɓaka wasu tsarin cikin sauƙi don amfani da allurar gas.
Yin amfani da nitrogen a cikin reflow soldering yana da fa'idodi masu zuwa:
‧Saurin jika na tashoshi da pads
‧ Little canji a solderability
‧Ingantacciyar bayyanar juzu'i da sauran farfajiyar haɗin gwiwa
‧ Saurin sanyaya ba tare da iskar oxygen da jan karfe ba
A matsayin iskar gas mai kariya, babban aikin nitrogen a cikin walda shine kawar da iskar oxygen yayin aikin walda, haɓaka walda, da hana sake yin iskar oxygen. Don amintaccen walda, ban da zabar solder mai dacewa, ana buƙatar haɗin gwiwar juzu'i gabaɗaya. Juyin ya fi kawar da oxides daga ɓangaren walda na ɓangaren SMA kafin waldawa kuma yana hana sake yin hadawan abu da iskar shaka na sashin walda, kuma yana samar da kyakkyawan yanayin wetting ga mai siyar don inganta ƙarfin solderability. . Gwaje-gwaje sun tabbatar da cewa ƙara formic acid a ƙarƙashin kariyar nitrogen na iya cimma abubuwan da ke sama. Na'urar siyar da igiyar ruwan nitrogen ta zoben da ke ɗaukar tsarin tankin walda mai nau'in rami shine tankin sarrafa walda mai nau'in rami. Rufin na sama yana kunshe da nau'ikan gilashin da za a iya buɗewa don tabbatar da cewa iskar oxygen ba zai iya shiga cikin tankin sarrafawa ba. Lokacin da aka shigar da nitrogen a cikin walda, ta yin amfani da nau'i daban-daban na iskar gas da iska mai kariya, nitrogen zai fitar da iska ta atomatik daga wurin walda. A lokacin aikin walda, hukumar PCB za ta ci gaba da kawo iskar oxygen zuwa wurin waldawa, don haka dole ne a ci gaba da yin allurar nitrogen a cikin yankin walda don ci gaba da fitar da iskar oxygen zuwa mashin.
Nitrogen da fasahar formic acid ana amfani da su gabaɗaya a cikin tanderun da ke sake kwarara irin na rami tare da infrared ingantattun haɗe-haɗe. Gabaɗaya an ƙirƙira mashigin da mashigar don buɗewa, kuma akwai labulen ƙofa da yawa a ciki tare da hatimi mai kyau, waɗanda za su iya yin zafi da dumama kayan aikin. Bushewa, reflow soldering da sanyaya duk an kammala a cikin rami. A cikin wannan mahaɗaɗɗen yanayi, man ɗin da aka yi amfani da shi ba ya buƙatar ƙunshe da masu kunnawa, kuma babu sauran da aka bari a kan PCB bayan sayar da su. Rage hadawan abu da iskar shaka, rage samuwar solder bukukuwa, kuma babu wani bridling, wanda yake da matukar amfani ga walda na lafiya-fitch na'urorin. Yana adana kayan aikin tsaftacewa kuma yana kare yanayin duniya. Ƙarin farashin da nitrogen ke bayarwa ana samun sauƙin dawowa daga ajiyar kuɗin da aka samu daga raguwar lahani da bukatun aiki.
Siyar da igiyar igiyar ruwa da reflow soldering a ƙarƙashin kariya ta nitrogen za ta zama babbar fasaha a cikin haɗuwa da ƙasa. The zobe nitrogen kalaman soldering inji yana hade da formic acid fasaha, da zobe nitrogen reflow soldering inji an haɗe shi da musamman low aiki solder manna da formic acid, wanda zai iya cire Tsaftacewa tsari. A cikin fasahar walda ta SMT da ke haɓaka cikin sauri a yau, babbar matsalar da aka fuskanta ita ce yadda ake cire oxides, samun tsaftataccen saman kayan tushe, da samun haɗin gwiwa mai dogaro. Yawanci, ana amfani da juzu'i don cire oxides, ɗora saman da za a sayar, rage tashin hankali na farfajiyar mai siyar, da hana sake yin iskar oxygen. Amma a lokaci guda, juyi zai bar ragowar bayan siyarwa, yana haifar da illa akan abubuwan PCB. Don haka, dole ne a tsabtace hukumar da'ira sosai. Duk da haka, girman SMD yana da ƙananan, kuma rata tsakanin sassan da ba a sayar da shi yana ƙara ƙarami da ƙarami. Tsaftacewa sosai ba zai yiwu ba. Abin da ya fi mahimmanci shine kare muhalli. CFCs suna haifar da lalacewa ga sararin samaniyar ozone, kuma dole ne a dakatar da CFCs a matsayin babban wakili mai tsaftacewa. Hanya mai inganci don magance matsalolin da ke sama ita ce amfani da fasaha mara tsafta a fagen hada wutar lantarki. Ƙara ƙarami da ƙididdiga na formic acid HCOOH zuwa nitrogen ya tabbatar da zama ingantaccen fasaha mara tsabta wanda baya buƙatar kowane tsaftacewa bayan walda, ba tare da wani tasiri ko damuwa game da ragowar ba.
Lokacin aikawa: Fabrairu-22-2024
